Pioneering Next-Gen Smart Semiconductor Manufacturing with "AI in Motion"
[Hsinchu] Mirle Group, a leading provider of intelligent semiconductor automation, will showcase at SEMICON Taiwan from September 2 to September 4, 2026 (Taipei Nangang Exhibition Center Hall 1, 4F, Booth: N0676). Centered around the theme "AI in Motion," Mirle will demonstrate its technological prowess under the banner "Empowering Next-Gen Semiconductor Manufacturing," delivering comprehensive solutions that integrate advanced packaging material handling, intelligent automation systems, and humanoid robotics.
Driven by the AI industrial revolution and surging demand across the semiconductor sector, advanced packaging and high-end substrates have become the core industry focus.
Leveraging extensive expertise in semiconductor automation integration, Mirle has set up an exclusive, appointment-only "VIP Exhibition Suite" at the booth to present on-site "AMHS / EFEM Solutions for FOPLP (Fan-Out Panel Level Packaging) and ABF Substrates" engineered for next-generation fabrication lines. The live demonstration seamlessly integrates EFEM with diverse OHT systems, alongside dynamic co-working demonstrations by four distinct AMR models, allowing clients to experience Mirle's latest innovations firsthand.
Furthermore, in the highly anticipated "AI Robotics Product Series" zone, Mirle will feature physical demonstrations of its humanoid robot and robotic dog, showcasing advanced AI technology, dexterous motion control, and cross-domain collaborative capabilities. Concurrently, key robotic components developed by Main Drive will be on display, underscoring Mirle Group’s proprietary R&D strength in core software and hardware technologies as well as its strategic supply chain deployment.
Mirle Group cordially invites industry leaders and partners to visit Booth N0676 (Taipei Nangang Exhibition Center Hall 1, 4F) to explore the future blueprint of AI and semiconductor automation and experience the new momentum driving next-generation smart manufacturing.
2026.08.31
Mirle Group at SEMICON Taiwan 2026
Pioneering Next-Gen Smart Semiconductor Manufacturing with "AI in Motion"
[Hsinchu] Mirle Group, a leading provider of intelligent semiconductor automation, will showcase at SEMICON Taiwan from September 2 to September 4, 2026 (Taipei Nangang Exhibition Center Hall 1, 4F, Booth: N0676). Centered around the theme "AI in Motion," Mirle will demonstrate its technological prowess under the banner "Empowering Next-Gen Semiconductor Manufacturing," delivering comprehensive solutions that integrate advanced packaging material handling, intelligent automation systems, and humanoid robotics.
Driven by the AI industrial revolution and surging demand across the semiconductor sector, advanced packaging and high-end substrates have become the core industry focus.
Leveraging extensive expertise in semiconductor automation integration, Mirle has set up an exclusive, appointment-only "VIP Exhibition Suite" at the booth to present on-site "AMHS / EFEM Solutions for FOPLP (Fan-Out Panel Level Packaging) and ABF Substrates" engineered for next-generation fabrication lines. The live demonstration seamlessly integrates EFEM with diverse OHT systems, alongside dynamic co-working demonstrations by four distinct AMR models, allowing clients to experience Mirle's latest innovations firsthand.
Furthermore, in the highly anticipated "AI Robotics Product Series" zone, Mirle will feature physical demonstrations of its humanoid robot and robotic dog, showcasing advanced AI technology, dexterous motion control, and cross-domain collaborative capabilities. Concurrently, key robotic components developed by Main Drive will be on display, underscoring Mirle Group’s proprietary R&D strength in core software and hardware technologies as well as its strategic supply chain deployment.
Mirle Group cordially invites industry leaders and partners to visit Booth N0676 (Taipei Nangang Exhibition Center Hall 1, 4F) to explore the future blueprint of AI and semiconductor automation and experience the new momentum driving next-generation smart manufacturing.
