By embedding semiconductor chips directly into large-area panels for fan-out packaging, FOPLP achieves a higher integration level, improved electrical performance, and larger package sizes. Compared to traditional packaging methods, FOPLP enables higher I/O density, effectively enhancing production efficiency and reducing manufacturing costs.
Learn More
Mirle Baymax AMR is an Autonomous Mobile Robot designed explicitly for semiconductor cleanrooms. It is equipped with a flexible robotic arm and is compact in size, enabling efficient operation in confined spaces, with a maximum load capacity of 25kg.
Learn More
Mirle’s two-phase immersion cooling technology draws on the management and design concept of the unmanned room, combining it with the intelligent transportation system, smart cooling system, and operations control center. This innovative and advanced technology enhances the efficiency, reliability, and intelligent management of data centers.
Learn More
In the future, humanoid robots will require AI capabilities, and their bodies need various components, including joint modules, lenses, sensors, and software. Among these, joint modules stand out as a critical component.
Learn More
