Mirle Group, in cooperation with the HsinChu Christian United Caring Association, Chinese Marketplace Torsion Association, and long-term local partners such as the YWCA, World Vision, Prison Fellowship, and various churches in Hsinchu, has been hosting the “Angels Come to Shine Charity Activity” for five years.
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By embedding semiconductor chips directly into large-area panels for fan-out packaging, FOPLP achieves a higher integration level, improved electrical performance, and larger package sizes. Compared to traditional packaging methods, FOPLP enables higher I/O density, effectively enhancing production efficiency and reducing manufacturing costs.
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Mirle Baymax AMR is an Autonomous Mobile Robot designed explicitly for semiconductor cleanrooms. It is equipped with a flexible robotic arm and is compact in size, enabling efficient operation in confined spaces, with a maximum load capacity of 25kg.
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Mirle Group Technology Inc., Shenzhen Kedali Industry Co., Ltd., and Suzhou Veichi Electric Co., Ltd. signed a "Joint Venture Agreement" to jointly invest in the establishment of Shenzhen Veidalee Innovation Technology Co., Ltd.
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Welcome to Visit Mirle Group@ Booth 1216, 2024SEMICON TAIWAN!
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Mirle’s two-phase immersion cooling technology draws on the management and design concept of the unmanned room, combining it with the intelligent transportation system, smart cooling system, and operations control center. This innovative and advanced technology enhances the efficiency, reliability, and intelligent management of data centers.
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Mirle Group, Main Drive Corporation, and Shenzhen Kedali Industry Co. Limited have formed a new joint venture company to enhance overall operational efficiency and expand into the humanoid robot market.
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In the future, humanoid robots will require AI capabilities, and their bodies need various components, including joint modules, lenses, sensors, and software. Among these, joint modules stand out as a critical component.
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