By embedding semiconductor chips directly into large-area panels for fan-out packaging, FOPLP achieves a higher integration level, improved electrical performance, and larger package sizes. Compared to traditional packaging methods, FOPLP enables higher I/O density, effectively enhancing production efficiency and reducing manufacturing costs.
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Mirle Baymax AMR is an Autonomous Mobile Robot designed explicitly for semiconductor cleanrooms. It is equipped with a flexible robotic arm and is compact in size, enabling efficient operation in confined spaces, with a maximum load capacity of 25kg.
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Mirle’s two-phase immersion cooling technology draws on the management and design concept of the unmanned room, combining it with the intelligent transportation system, smart cooling system, and operations control center. This innovative and advanced technology enhances the efficiency, reliability, and intelligent management of data centers.
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In the future, humanoid robots will require AI capabilities, and their bodies need various components, including joint modules, lenses, sensors, and software. Among these, joint modules stand out as a critical component.
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IPM is a proactive strategy that monitors equipment’s degradation anomalies and uses AI algorithms to predict when equipment may malfunction so that maintenance or repair can be arranged before failure occurs.
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Mirle Equipment Data Management (EDM) system provides functionality to support for automated production and logistics management, helping corporates collect and analyze large amounts of data to obtain valuable information and insights, assisting corporates in decision-making, and optimizing business operations.
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EHM covers functions of inspection, diagnosis, and prediction of equipment health, which lays the crucial foundation of digital transformation and digital decision-making for manufacturers.
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Mirle Group builds MIPC (Mirle Industrial PC) as the intelligent control core of each device. It provides functions such as monitoring, control, or testing of machines or equipment in the manufacturing process and enables Mechanical equipment to become more sophisticated and intelligent.
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The Mini OHT product of Mirle Group is the first in the world. Its flat and small shape is specially designed for OSAT factories. It is suitable for factory buildings with space height below 3000 mm. It can simultaneously and flexibly move up and down to the left or right side. The hoisting stroke can be adjusted and set according to the client's actual project needs.
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Mirle Group has provided equipment to the semiconductor industry. In response to the client’s needs, such as flexible production processes and limited factory space, Mirle has developed a ZIP STK storage device and successfully implemented it in large semiconductor packaging and testing factories.
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Mirle Group is committed to the research and development of EFEM and continues to improve and optimize it. Mirle EFEM can provide ABF substrates with automatic modules for front-end Loading &Unloading function and can fully meet the needs and restrictions of clients' process machines.
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